Cov Khoom Siv Cov Khoom Siv & Khoom

Muaj pes tsawg	Cov yam ntxwv tseem ceeb	Cov Kev Siv Raug Raug
W -10 cu	Ultra-siab thermal conductivity (180 w / min k)	High-power hluav taws xob substrates
W -20 cu	Optimal CTE Match rau Ceramics	RF / microwave pob ntawv
W -30 cu	Kev Ntsuas Lub Zog / Conductivity	Edm Electrodes, Arc-resistant seem
W -40 / 50cu	Kom tau zoo tshuab	Hnyav-Luag Haujlwm Cov Hluav Taws Xob

Cov ntsiab lus tseem ceeb

Complex 3D geometries- Txuj Ci Txias Raws Thiab Inricate Cov Nta Tsis Muaj Peev Xwm Nrog PM
Cov Khoom Siv Cua Sov Khoom- CTE 6. {{{5-9. 5 × 10⁻⁶ / degree kho tau kom phim cov ntaub ntawv uas nyob ib sab
Superior density- ua tiav 97-99}}% theoretical density vs. 90-93% nrog infiltration
Tus Nqi Muaj Zog- Txo cov tooj liab khib nyiab los ntawm 40% piv rau txoj kev infiltration
Microstructural tsis sib xws- Homogeneous theem kev faib khoom tsis muaj tooj liab pas dej

Kev Ua Tshwj Xeeb

Chaw ua uas tsis tau haus	Kev qhia tshwj xeeb
Ceev	Ntau dua los yog sib npaug rau 97% theoretical
Thermal conductivity	160-240 w / min k (sib sau ua ke)
Hluav Taws Xob Kev Tshaj Tawm	45-60% IACs
Hardness (HV)	150-350
Qhov tsawg kawg nkaus tshwj xeeb loj	0. 5 hli
Do roughness (as-sintered)	Ra 2. {{0-4. 0 μm
Sintering kub	1300-1500 degree (hydrogen)

Cov Kev Siv Raug Raug

Nrhiav Hluav Taws Xob Hluav Taws Xob

High-fais fab LED Rhaub So

CPU / GPU thermal repers

Igbt balloplates

Laser Diode mounts

Hluav Taws Xob & Voltage Ntau

Nqus cov neeg sib tshuam

Ua hauj lwm vuam electrodes

Circuit Court Cov Txheej Txheem

Cov tsheb npav muaj tsheb npav siab

Aerospace & Tiv Thaiv

Cov teeb meem kev qhia txog cov khoom siv hluav taws xob system

Radar T / R Module Carrier

Satellite Thermal dav hlau

Qhia Cov Hluav Taws Xob Hluav Taws Xob Hluav Taws Xob

Muaj Tshuab

Cov hluav taws xob EDM (cov duab 3D)

Plasma To Tawb Nozzles

Vuam Teeb Khoom Cheebtsam

High-kub rauv yooj yim fixtures

Cov txheej txheem tsim khoom

Hmoov noj - pre-alloyed w-cu lossis composite hmoov (d {{} μm)
Feedstock kev loj hlob - Kev cai tuav system rau homogeneous sib tov
Txhaj Tshuaj Molding - Precision Sib Tw Ntawm Cov Khoom Siv Complex Geometries
Catalytic debinding - tswj tau ntau-theem kev tshem tawm
Kua-Cheeb Tsam Sintering - Kub Profile Zoo Rau Qhov
Kub Isostatic nias - Yeem rau 100% ntom
Plating / txheej - NI / AU kev kho kom muaj kev kho mob thaum yuav tsum tau ua

Kev Muaj Peev Xwm Zoo

Qhov ntsuas qhov ntsuas (cov qauv archedes)
Thermal / Hluav Taws Xob Kev Tshawb Fawb
Kev Tshawb Xyuas Microstructiving (SEM / Eds theem faib tawm)
CTE ntsuas (Dilatometer Testing)
Kev sim siab tam sim no rau cov khoom siv hluav taws xob
X-ray kuaj xyuas rau sab hauv qhov tsis xws luag

Vim li cas thiaj xaiv W-CU Mim?

Tsim Tsim Kho Tshiab- Pab kom ua tau cov kev daws teeb meem ua ke nrog cov kev daws teeb meem nyuaj
Ua tau zoo sib xws- Tshem tawm cov tooj liab pas dej txawv hloov pauv ntawm infiltration
Cov Khoom Txhuam Khoom- txo tungsten machining khib nyiab ntawm 70-80%
Lawb lawb lawb- nrawm dua li cov pa xovxwm-sinter-infiltrate txheej txheem
Khoom Siv Vaj Tsev- Kho tau W: CU piv rau kev thov-cov kev xav tau

Tungsten-Tooj liab piv txog kev sib tawg rau cov khoom siv hluav taws xob hauv siab thiab hluav taws xob. Peb cov txheej txheem tsim qauv kom pom tau microstructure txoj kev txhim kho microstructure thaum tswj cov geometric hloov ntawm kev txhaj tshuaj molding tshuab.

Hu rau peb cov ntaub ntawv engineering engineering los tham txog koj W-CU thermal mana.